Trash80toHP_Mini
NIGHT STALKER
What's really nice about using the epoxy embedment/milling machine approach is that you don't need to desolder anything but the proprietary logic and anything else you might want. The first couple of passes will remove all the solder cones/pins and raze the metal bits off at each layer. [}]Sure i'd take that method - as long as i get scans of the layers, i don't care how they were obtained - if someone else wants to do the disassembly and scan the layers at 1200dpi, i'll do the work in sprint.
Don't we have all that on the Bomarc schematic? Gotta get that one to see if it has the info missing from Apple's.Also be fore-warned: the official SE/30 schematics are missing a couple pages, and they contain all the test points, and resistor networks. So DONT forget those!