MacOSMonkey
Well-known member
Good job. It could have been bad solder, debris or electrolytic corrosion. Unless you thoroughly clean the hole (and the pins -- to remove any oxidation/surface issues, there could be residual problems (and it might depend on the degree of via-trace dendrite invasion, etc.). If there is debris or corrosion at the trace end, then it might not matter how many times you solder it. If the traces were not resistive (perhaps implying little discontinuity or dendritic corrosion), then the heating impact may have been timing-related and adding a DIP socket may have added a very slight propagation delay (maybe ~30-40ps? -- it might not need much), plus an impedance and trace characteristic change -- possible reflections, reduced pin contact area -- maybe changed the signal propagation. You could scope a soldered vs. socketed part to see what the signals look like and if there is any significant difference. It could have also been something related to the package and wire bond connections. Using a DIP socket usually applies additional inward flex strain to the pins -- more than a PCB through-hole footprint would. Anyway -- glad it's working! And, it sounds like there is enough clearance for mounting the daughtercard with the DIP socket added -- so...great!
