That interchange about package thickness and available cubic in the 603e PowerBooks made the 1400 processor card the only logical lab varmint.
The 1400s heat spreader is a removable 2mm aluminum assembly, not an integral magnesium frame as in the 2300c target machine for the theoretical interstitial adapter. Its thickness provides wiggle room of 1mm by way of milling away the surface.
That surface is a stamped indent on the assembly of about 4mm. The cubic it occupies under the top surface provides a last resort opportunity to mill a large opening for a massive copper adapter.
Was hoping for a better shot, but this shows the spatial relationships clearly enough.
As I said, that space makes the easily pulled CPU daughtercard of the 1400 the most logical choice for a 603e PowerBook upgrade that challenges anything available in the day. The 1400 was the only possibility for accelerator manufacturers outside of the 2400c with I've never even seen and far too valuable to be used as a lab rat.
The stack of 1400s, my attachment to the machine that led to it and the several extra logic boards and processor cards from the stack reduction project makes this no-brainer for something this insane. I've been working my way from PBX and the logic board connectors toward the PCMCIA cage/daughtercard interconnect on and off for 15 years now. The aim has always been to translate that half of the 1400'x split I/O bus into the Docking Connector of the Duo 2300c. Feasibility of physical installation of the 1400 PCMCIA assembly into the HDD bay of the 2300c was a done deal 15 years back! G3 insanity dovetails very nicely with that project on both sides of the shared PBX controllers in that Dynamic Duo.
dr. bob gave me a crash course on the basics of high frequency signalling after he finally gave in and admitted that the 1400 and 2300c are the same outside of the 1MB VRAM/ECSC upgrade of the 512K(?) VRAM/CSC Video Controller***** of the baseline 2300c. All other components of the 1400 were offloaded to the Docking Connector of the 2300c. Transplanting a 1400/G3 into the 2300c was the impossible dream of that full on manic episode. Guess what? 15 years and the dawn of the RaspBerry Pi/10x10cm SEEED PCB prototyping age and a partial return to sanity makes that proposition impractical, but maybe possible given interstitial adapter development?
Note the "1600" printed on the lower left corner of the (333MHz? )Sonnet card, what's that all about I wonder?
Another denizen of the 1400 stack reduction project box makes things a lot easier. Designing a breakout board PCB for the interboard connect is probably the first step on the journey. The PCB will have matching pads top and bottom for male/female header direct connection of harvested connectors and the pair will act as an interstertial breadboard interface. First for when the time comes to play with the 750FX on a header matching protoboard. Hoping an underclock of the logic board enough that breadboarding will be possible while retaining function of the external video card.
This Minimalist/1400 configuration mockup is a direct descendant of the original DuoDock based Minimalist/Duo 230 project box. The PCMCIA Card Cage/Daughtercard assembly will be removed on one left side of the CPU and the BookEndz Dock project box approach allows the breakout board to overhang KBD, speaker and LCD connectors at top and bottom. figuring out an adequate line driver/buffer setup for such a massive breadboard prototyping contraption is something someone else will have to do for me. Cubic aggregation building blocks and visual PCB trace schematic development I can do, but not the complicated electron pusher kinda stuff.
Adapter stack PCB development is my first order of business if this methodology proposal passes muster. Lil' help with that determination please. :huh:
*****maddog successfully gave the 2300c an ECSC transplant, but may have never gotten to or past feasibility studies for a 2300c VRAM upgrade. Full screen16bit on that gorgeous 2300c LCD would be very, very nice indeed!