kkritsilas
Well-known member
Hi,
Slowly getting to work on my Pismo (currently non-functional) by getting the memory modules replaced/upgraded. For a refresher, I got this from a local electronics recycler for $12, but it was incomplete (missing RF shield over the the CPU card, no HD bracket or cable, no charger). It is the basic Pismo, 400MHz CPU, 64MB Ram, originally had a 10GB HD, DVD ROM in the right side bay, and a battery in the left side bay). In removing the CPU board to replace the RAM module, I removed the heat sink plate (two small screws over what I think is the CPU, one long screw that holds down the rest of the heat sink assembly). The bottom of the heat sink plate (the part that fits over the CPU) did not have thermal compound, but a black thermal pad. I put the new 512MB modules in, added the replacement IDE cable, and then replaced the CPU board, and temporarily put the heat sink assembly back. What is the correct thermal material to use on the CPU? Do I need to use another thermal pad, or can I use the usual CPU heat sink compounds from Arctic Silver/Thermaltake/BeCool/etc.? The pad that is on there now seems to have been squashed down pretty hard, so I guess that if I used a thermal pad, it would need to be approximately the same thickness (does anybody know what that is?).
I don't want to try to turn on the Pismo (it was completely dead, as in no power on chime or even the display backlight coming on) prior to my latest efforts, but I also don't want to overheat anything due to my having removed the heat sink and breaking the thermal interface between the CPU and the heatsink.
Slowly getting to work on my Pismo (currently non-functional) by getting the memory modules replaced/upgraded. For a refresher, I got this from a local electronics recycler for $12, but it was incomplete (missing RF shield over the the CPU card, no HD bracket or cable, no charger). It is the basic Pismo, 400MHz CPU, 64MB Ram, originally had a 10GB HD, DVD ROM in the right side bay, and a battery in the left side bay). In removing the CPU board to replace the RAM module, I removed the heat sink plate (two small screws over what I think is the CPU, one long screw that holds down the rest of the heat sink assembly). The bottom of the heat sink plate (the part that fits over the CPU) did not have thermal compound, but a black thermal pad. I put the new 512MB modules in, added the replacement IDE cable, and then replaced the CPU board, and temporarily put the heat sink assembly back. What is the correct thermal material to use on the CPU? Do I need to use another thermal pad, or can I use the usual CPU heat sink compounds from Arctic Silver/Thermaltake/BeCool/etc.? The pad that is on there now seems to have been squashed down pretty hard, so I guess that if I used a thermal pad, it would need to be approximately the same thickness (does anybody know what that is?).
I don't want to try to turn on the Pismo (it was completely dead, as in no power on chime or even the display backlight coming on) prior to my latest efforts, but I also don't want to overheat anything due to my having removed the heat sink and breaking the thermal interface between the CPU and the heatsink.