Hi everyone,
I'm working on recapping my Macintosh SE/30 and I've run into an issue: when I remove the old electrolytic capacitors (3 so far), the solder pad lifts off the board with the cap.
I'm wondering if this is due to:
- the type/quality of flux I'm using
- my hot air temperature
-not heating long enough (or too long)
or if the pads are already weakened from electrolyte leakage
I'm using hot air, and I'm trying to be gentle, but the pads still seem very fragile.
Is this a common problem on SE/30 boards? What's the recommended technique to remove the original caps safely?
Any tips would be greatly appreciated - I'd like to avoid damaging more traces.
Thanks!
I'm working on recapping my Macintosh SE/30 and I've run into an issue: when I remove the old electrolytic capacitors (3 so far), the solder pad lifts off the board with the cap.
I'm wondering if this is due to:
- the type/quality of flux I'm using
- my hot air temperature
-not heating long enough (or too long)
or if the pads are already weakened from electrolyte leakage
I'm using hot air, and I'm trying to be gentle, but the pads still seem very fragile.
Is this a common problem on SE/30 boards? What's the recommended technique to remove the original caps safely?
Any tips would be greatly appreciated - I'd like to avoid damaging more traces.
Thanks!

