] ]'>
(such as upgrading the rather pedestrian 100 Mhz 603e to an early G3) 
That IS part of the project, but to increase it to a much faster G-3 multiplier. The DuoMauler I mentioned in the Unimplemented Pads Thread as as having successfully transplanted the Video IC, could never find the "bus clock multiplier resistors," which I suspect were intentionally hidden at far spread corners of the MoBo to avoid just what you are suggesting.
] ]'>You've just gotta find the last revision KBD . . . :... a total keyboard replacement for the slush-boxes they call "keyboards" on Duo portables!
. . . and then learn to live with it. :-/
If you're talking about the early G-3 that was specifically designed to be "pad" compatible with the 603e in the 2300c, there IS a source for the necessary CPU's, but it's a crapshoot in every case as to whether the "donor" has the 603e Package CPU in the Duo* or the later QFP (?) version of the G-3 CPU.
] ]'>] ]'>It'll have to be a TEAM effort, I probably can't manage to do all the research on my own, so I'll be posting threads to define all the necessary lines of research and ask for volunteers to be part of this particular 68kMLA "Mission" and I'll be posting some very Interesting sideline research topics, like the DuoDock II: UNIMPLEMENTED PADS PROJECT!*
] ]'>] ]'>
Would that be Tom's House of Hardware Hacking Horrors?
DIP switch, if there's room - makes experimenting with different settings a heck of a lot easier.
I'm with Byrd on this one. My vague thoughts along those lines include finding a decent mini keyboard at the swap meets, remapping the matrix (cut and join, cut and join), and connecting it to the Duo internal ADB ribbons.
Sparkfun Electronics and Australian ebay seller stuffdownunder both seem to have supplies of QFP-to-x adapter boards/sockets.
That's a big shift in focus, jt, and a huge leap in (in)feasibility - from a theoretically possible CPU transplant to designing and making an entire new SFF logic board from scratch. I hope you won't be abandoning your original line of enquiry completely.
Nice board - but why just for an "I/O subsystem"? Why not pop an extra $30 for a complete ARM board with better specs? I guess I'm not following your new direction 100% just yet.
MiniITX (or similar) board with LVDS out. Compatible LVDS LCD. 12V worth of AA Lithium rechargables; lithium charger board/s. Bake on high for 30 minutes and cool before serving.
Probably, the name rings a few bells.
That's one reason I'm seriously considering the PB100 as my baseline unit, I've already hacked a 1400 KBD onto BabyPB . . . and she's got the ultimate in spherically correct pointing devices when it comes to size/usability. BTW, there are MUCH more efficient means of prototyping KBDs, one of which is to fab a fiberglas copper-clad etched PCB replacement for the bottom membrane, thus stiffening said spongeboard! [
] ]'> At what cost? If not astronomical, will the adapted CPU interface efficiently with the Duo's heatsink? . . . methinks NOT!
Not really, it makes the hack MUCH easier!
That'd be a "carrier" board in the Duo form factor that "bolts right up" to the Duo's magnesium frame and has the same (or improved replacements) I/O and battery connections (or an expansion bay and INTERNAL battery combo) and places a VERY CAPABLE CPU under the magnesium heat sink or near enough to it that a solid gold (or better heat transfer medium, if available) adapter could take up the slack.
Will said ARM outperform the Atom ChipSet in HP_Mini? All I'm looking for at this point is an open Source board that is capable of fulfilling all the functions of the PBX Bridge IC and ALL the slow bus subsystems of the "ubuntuDu . . . erm . . . SuperDuo!" The CPU Card/Memory, fast i/O bus would be another matter entirely.
I'm not yet familiar with those form factors or their heating/cooling/power/space/location requirements, but you're getting the general idea, it's just that all the parts need to be tied together by a Duo Form Factor carrier (think prototyping or even breadboarding level PCB) "MoBo" with as little circuitry on it as possible, which won't be much considering modern interfaces.
I'm sure we're BOTH missing a LOT here at this point, hence the title "brainstorming session!" [
] ]'>] ]'>
According to what I've read about the G-3, probably on Motorola's site, it was intentionally designed to be pad compatible with the QFP packaged 603e.
] ]'>
I'm pretty sure the posts & piccies re the donor are over in the 'fritter archives, I'll check my various HDDs from that era for the pics, as I'm POSITIVE that I'd have glommed 'em!
I'm only going by what DuoMauler has said over on 'fritter and in emails/pms to me, but I'm CERTAIN he knew exactly what he was talking about!
I think I may be able to find one, but reworking a QFP on a PCB is very likely beyond my present skill set. Designing a "carrier board" and installing modern components would be right up my alley though! I first conceived of this approach for upgrading the "Luggable" which has LOTS of PCB acreage to play around in . . . but I can't even afford a DOA unit and I'm NOT hackin' my pristine NASA property plated Portable! [
] ]'>] ]'>THX, I thought it was pretty nifty too, just wish I'd have thought of it back in the day! DuoMauler woulda' JUMPED on that one! He had QFP G-3s AND the skills to rework the MoBo! I've just gotta get into contact with him again!
I doubt that even Apple would have bothered with such nonsense on PBs w/o upgradeable ProcCards on board. Besides, Apple has ALWAYS had enough accidental issues w/ROMs. Remember the '030 "dirty ROMS" fiasco and the (likely multi-millionaires) who developed and patented Mode32? [
] ]'>
Yep, that works tooBTW, there are MUCH more efficient means of prototyping KBDs, one of which is to fab a fiberglas copper-clad etched PCB replacement for the bottom membrane, thus stiffening said spongeboard! [
Just for clarity, this thread is about two different hacks:. . . and why would the interface need to be ADB? }
I would assume replacing the original barely adequate heatsink was part of the equation when contemplating a CPU transplant.
Right, now I follow you. You want to make up a carrier board for an available logic board that breaks its I/O out to the Duo's physical ports, and to the LCD. Sounds eminently doable. Similar to the "stealth" casemods that have been performed on desktop machines, and eerily similar to a plan I've been slowly brewing for the much more spacious shell of a PB520/540.
Probably not, no. But even the one you post above would outrun a Duo, and give a low-end G3 a decent run for its money.
Again, for clarity:
Nope, you've lost me again. The embedded boards you seem to be discussing are all highly integrated - I'm not aware of any that place the CPU and/or any I/O on daughterboards.
Mini-ITX is just a board form factor specification, like ATX. As such, there are boards available from a number of manufacturers, with everything imaginable on them, from low-power, low-heat 500MHz Pentium III derived CPUs, to ARMs, to embedded PPCs }
, integrated media processors (combined GPUs, codecs and audio DSPs), to dual sockets for a pair of quad core Xeons. Power, heat, cost, ease of development and availability vary accordingly. ):Quite a large number of MiniITX boards have LVDS out for LCD video built-in - so you can connect directly to a bare LCD panel without the added, and substantial, expense of a DVI or VGA converter/controller board.BTW: FPGA technology will (should) allow implementation of LVDS out among other things.
[Yep, that works tooBTW, there are MUCH more efficient means of prototyping KBDs, one of which is to fab a fiberglas copper-clad etched PCB replacement for the bottom membrane, thus stiffening said spongeboard! [
] ]'>I'm just along for the ride on the G-3 Duo now that I've got the "Open Source" Bug, but yes, ADB would only be required for the AppleCentricHack.Just for clarity, this thread is about two different hacks:. . . and why would the interface need to be ADB? }
- G3 on original Duo logic board
- New logic in Duo shell
Correct? ADB would only be required for the first hack."]
I wasn't so sure the Duo's heatsink arrangement was all that bad. :?:
Sick minds think alike! }
IIRC, the entire magnesium frame of the Duo is the heatsink, the little projection is a heatpipe to the chassis.
Thought of it, rejected it, there's room for a bigger screen and a MUCH better proc than the current crop of NetBooks offer! }
I realise now it's the 1400's heatsink that has been floating before my eyes. I've seen that much more often than the Duo one, and I had them mixed up. And it is to the 1400 that the following was addressed:
I must take a gander inside a Duo again to refresh my memory.
Do you actually mean a heatpipe as defined here, or just a chunk of metal?
