Figured I'd start a topic for this separately
So what I've noticed is that the larger, OEM-like CPU daughtercards had quite a large footprint, and would have a proportionally large heatsink; ergo the mounting would be able to span the card.
Upgrades, especially later 1990s and early 2000s had a much smaller PCB footprint and (apparently) had more compact heatsink mounting solutions. Mine was absent on the PowerLogix card in my PowerWave, and want a good solution.
I made progress on my own but paused to ask any willing forum members to photograph what their cards' mounts look like. Here's what I've done so far: measured the PCB, the CPU substrate, got specs and measurements of the gaps and based my drawings off photographs of what I could find.
The original, circular heatsink appeared to be 54mm diameter. I wonder what solution they have, because there's only a 6mm gap between the CPU and the dip switches, the 755 package being 25mm square.
There's only ~1mm clearance between the PCB and the bottom of the CPU
That is a not-quite-engineering-correct representation of a 27.94mm heatsink i found, that actually has a photo reference of a 604 PPC chip in it! Found it on Mouser, I'll post the link later.
I'm working with a friend on the 3d printing and testing material tolerances.
Anyhow, I hope this is roughly on the right track, but would appreciate any additional insight.
So what I've noticed is that the larger, OEM-like CPU daughtercards had quite a large footprint, and would have a proportionally large heatsink; ergo the mounting would be able to span the card.
Upgrades, especially later 1990s and early 2000s had a much smaller PCB footprint and (apparently) had more compact heatsink mounting solutions. Mine was absent on the PowerLogix card in my PowerWave, and want a good solution.
I made progress on my own but paused to ask any willing forum members to photograph what their cards' mounts look like. Here's what I've done so far: measured the PCB, the CPU substrate, got specs and measurements of the gaps and based my drawings off photographs of what I could find.
The original, circular heatsink appeared to be 54mm diameter. I wonder what solution they have, because there's only a 6mm gap between the CPU and the dip switches, the 755 package being 25mm square.
There's only ~1mm clearance between the PCB and the bottom of the CPU
I'm working with a friend on the 3d printing and testing material tolerances.
Anyhow, I hope this is roughly on the right track, but would appreciate any additional insight.






