LC475 with no video
- Thread starter falen6
- Start date
when i suspected cap goo breaking connections I started reflowing pins - this chip was the first
i may have reflowed it twice ( maybe i missed one mentality )
allot of cap goo plus 2 bouts of heat did not fare out well
saying that i have had to reflow pins/pads on other boards several times without pads lifting
i put it down to sustained heat on a small pad is bad ........... sustained heat on a pad that has been 'electrolighted' is very very bad........
to them blast the whole area with a heat gun ................ ah well
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there is basically zero clearance under these ram chips to run jumper wires under them , unless i start bending the pins to create more clearence
dont really want to go there
thats why im thinking of of using sticky copper tape - top left 3 pads missing , im thinking - prep the vias ( tiny sharp pin , dig out the via , file sharp point on soledring iron , flux / solder iron get good via contact - lay copper tape over the 3 missing pads and cover top half of vias - with sharp scalpal knife cut away the copper inbetween to create 3 new pads and traces - finish by soldering copper trace to via )
has anyone had any success with this method
i know i could just start running jumper wires from all over the place , including the back of the board but it be fugly
at least there are several pads that still look good , that will hold the chip solid , so the new connections wont be load bearing
imagine ...... it still gives a good chime !! , and not with just the chip removed , but the 2 caps as well !!!
i may have reflowed it twice ( maybe i missed one mentality )
allot of cap goo plus 2 bouts of heat did not fare out well
saying that i have had to reflow pins/pads on other boards several times without pads lifting
i put it down to sustained heat on a small pad is bad ........... sustained heat on a pad that has been 'electrolighted' is very very bad........
to them blast the whole area with a heat gun ................ ah well
----------------
there is basically zero clearance under these ram chips to run jumper wires under them , unless i start bending the pins to create more clearence
dont really want to go there
thats why im thinking of of using sticky copper tape - top left 3 pads missing , im thinking - prep the vias ( tiny sharp pin , dig out the via , file sharp point on soledring iron , flux / solder iron get good via contact - lay copper tape over the 3 missing pads and cover top half of vias - with sharp scalpal knife cut away the copper inbetween to create 3 new pads and traces - finish by soldering copper trace to via )
has anyone had any success with this method
i know i could just start running jumper wires from all over the place , including the back of the board but it be fugly
at least there are several pads that still look good , that will hold the chip solid , so the new connections wont be load bearing
imagine ...... it still gives a good chime !! , and not with just the chip removed , but the 2 caps as well !!!
SMD packages don't sit completely flush to the board. If you use #32 bare wire there should be plenty of clearance.
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