I am recapping an LC1. All went well except... 1 lifted pad. sigh...
This one had a trace leading to a via, so this time I just soldered the cap to the via, following archer174's suggestion. I am wondering if I could've just soldered it to the IC leg? presumably the via, between the IC and the cap has a reason for being though...
Looks fine to me. I lifted a pad off one machine I was working on, and I used a small piece of jumper wire (the kind used for fixing traces.) That way I could satisfy my OCD and have straight caps.
Well, the recapping seemed to go well, but when I booted it up... no sound!
So, I went through the archives on here... and sure enough someone else had the same problem. I checked the traces, soaked the board in soapy water, dried it off with my air brush, reflowed the solder on Q1....
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