We were just discussing this in a thread on Trading Post. A great deal of searching has not turned up the sockets with the proper spacing for the SE/30. It looks like the Jameco sockets could probably be sawn apart and used.
If you'd like to try it shoot me a PM. If it works for you, maybe I'll offer them for sale with the capacitors.
And since I'm posting anyway, I'll mention that I like to use an adjustable heat gun for desoldering, going back to the earlier discussion. I wasn't going to bother, but as I wrote, I'm already typing.
A desoldering station is almost certainly better, if you have or can afford one, but I've had great results with my Milwaukee heat gun. It has a dial on the back for continuously adjusting the temperature from room up to I don't know. It goes from 1 to 10, so that could be 100 to 1000F, but I don't know. I find that a setting of 8 to 9 for one or two minutes will nicely desolder things like 32 pin DIPs.
I use a lot of modeling clay -- the stuff that stays soft that you can get at Hobby Lobby. The stuff I have is gray/white uncolored. I've seen green, but I think the dye might be a bad idea.
The first thing I use the clay for is to cover nearby components that aren't involved in the desoldering operation. The first time I used a heat gun for desoldering, I blew a bunch of SM resistors and resistor arrays off the board and I had no idea where they came from.
Small parts are usually in rows and columns, so I just roll some snakes of the proper length and then press the snake onto the row or column of resistors or caps, to protect them.
The other thing I do with the clay is build little pedestals. If I'm desoldering a through-hole component, like a 32 pin DIP or a SIMM socket, I'll support the board on little clay pedestals with the component on the underside. As the board heats, I test the solder by poking the through holes with a dental pick. That way if the heating is uneven, I can detect which holes need a little more heat. It also helps to give the pins a little push once all the solder is melted, so get the component to fall out.
I must have desoldered at least forty 32 pin DIPs this way when I was converting UltraTek/66 cards. And I was able to reuse every Flash chip I desoldered. There was a resistor that needed moving, under the flash chip, plus it simplified reprogramming the flash once it was off the board.