trag and I were discussing a notion I had for doing double sided SMT fabrication quite a while back. IIRC it was for SIMM fabrication and the melting point differential was great enough to make it workable? I'm curious now about finding a minimum of three solder types with workable melting point differentials. Among other things, this would enable reworking QFP CPU pads with an adapter plate allowing for a different (smaller) footprint CPU in a different package to be substituted.
Suggestions for implementing a more flexible stepped re-work process?
Suggestions for implementing a more flexible stepped re-work process?